From sher@slac.stanford.edu Thu Dec 24 22:24:02 2009
Date: Fri, 25 Dec 2009 00:23:55 -0800
From: "Parker, Sherwood" <sher@slac.stanford.edu>
To: varner@phys.hawaii.edu
Subject: draft letter of intent

Hi Gary,
 
Here is a first draft.  Feel free to comment, suggest changes, etc.
 
Sherwood
 

Advanced Detector Program, 2010, Advances in 3D silicon sensors, Letter of Intent

 

In beam, x-ray, and source tests as published in 22 papers, 3D sensors, which have electrodes that penetrate into the substrate rather than those of planar sensors that are confined to the surface regions, 

*	have been shown to have an order-of-magnitude greater resistance to radiation damage than existing planar sensors,
*	have edge dead-regions of less than 10 microns vs. 1.1 mm for LHC radiation-hardened planar sensors
*	in barrel layers of  detectors such as ATLAS having solenoidal magnetic fields, are not affected measurably by those fields.

We propose to continue 3D sensor development, concentrating on

*	high-speed, sub-nanosecond timing,
*	measurement of, and increases of the efficiency of collecting charge from ionization inside the electrodes,
*	improvements in fabrication yield.

The high-speed, sub-nanosecond timing will involve

*	development of trench-electrode sensors in which the depleted regions are bound by parallel electrodes that provide high, and nearly uniform electric fields,
*	fast pixel-array current amplifiers, and
*	fast pixel-array wave-form tracers.

The last two items will involve the development of deep-sub-micron custom VLSI electronics by a group at the High-Energy Physics Group at University of Hawaii lead by Dr. Gary Varner, with whom we would expect to work in close cooperation.

Sherwood Parker

High-Energy Physics Group,

University of Hawaii